Product Description
After A/B mixing, it forms a flexible protective layer for electronics, power modules, LED, new energy and automotive applications.

Potting Materials
Two-component addition-cure potting compound with low viscosity, high flowability and electrical insulation.
After A/B mixing, it forms a flexible protective layer for electronics, power modules, LED, new energy and automotive applications.






| Product name | 1:1 Two-component Addition-cure Potting Compound |
|---|---|
| Product category | Potting Materials |
| Model series | additionCurePottingParameters |
Huinergy Silicone engineering team provides material selection recommendations and technical support based on your application requirements.