Potting Materials
A 10:1 two-component condensation-cure potting compound with good flowability, relatively fast curing, stable heat dissipation, electrical insulation and moisture protection for LED lighting, automotive electronics, power supplies and new energy equipment.
10:1 two-component condensation-cure potting compound is a silicone encapsulation material for protecting electronic assemblies. It offers good flowability and relatively fast curing without releasing oily substances. After curing, it remains elastic and provides moisture resistance, electrical insulation and heat dissipation for LED lighting, automotive modules, power supplies, electronic components and new energy equipment.
| Product Model | Color | Mixed Viscosity (CP) | Operating Temperature (℃) | Curing Time for 1cm Thickness (h) | Tensile Strength (MPa) | Hardness (Shore A) | Flame Retardancy | Thermal Conductivity (W/M·K) | Volume Resistivity (Ω·cm) |
|---|---|---|---|---|---|---|---|---|---|
| CL-1800 | Black | 2000-2400 | 5-40 | 3-4 | ≤1 | 25±5 | UL94 V-1 | — | — |
| CL-1803 | Black, white | 1200-1800 | 5-40 | 3-4 | ≤1 | 30±5 | UL94 V-1 | — | — |
| CL-1808 | Black, white | 1400-2000 | 5-40 | 3-4 | ≤1 | 30±5 | UL94 V-1 | — | — |
| CL-1905 | Transparent | 1600-2000 | 5-40 | 8-24 | ≤1 | 25±5 | UL94 V-1 | — | — |
Huinergy Silicone engineering team provides material selection recommendations and technical support based on your application requirements.
