Adhesive Materials
This addition-cure single-component adhesive provides rapid curing, excellent adhesion, high-temperature resistance and electrical insulation performance. It is suitable for bonding and packaging electronic components on PCB boards, aluminum substrates and ceramic substrates.
This product cures rapidly under heating conditions and provides excellent adhesion, high-temperature resistance and good electrical insulation. It is suitable for bonding and packaging electronic devices on PCB boards, aluminum substrates and ceramic substrates.
| Product Model | Color | Viscosity (Pa.s) | Density (g/cm³) | Hardness (Shore A) | Thixotropic Index | Curing Conditions (150℃, min) |
|---|---|---|---|---|---|---|
| DAM-868A | White | 13000 ± 2000 | 1.12 | 50-55A | 4.6 | 10-30 |
| DAM-868B | Black | 13000 ± 2000 | 1.12 | 50-55A | 4.6 | 10-30 |
| DAM-868T | Transparent | 11000 ± 1000 | 1.03 | 45-50A | 4.3 | 10-30 |
Huinergy Silicone engineering team provides material selection recommendations and technical support based on your application requirements.
