Product Description
Liquid metal paste is used for interface cooling in high-performance chips, servers, power electronics and telecom equipment.
Thermal Interface Materials
Liquid Metal Paste
High-conductivity liquid metal interface material for high heat-flux devices.
Product Features
◆ High-conductivity liquid metal interface material for high heat-flux devices.◆ See the product-series technical parameter table
Typical Applications
Product Parameters
| Product name | Liquid Metal Paste |
|---|---|
| Product category | Thermal Interface Materials |
| Model series | liquidMetalParameters |
Need Technical Support or Sample Testing?
Huinergy Silicone engineering team provides material selection recommendations and technical support based on your application requirements.