PRODUCT INFORMATION
Thermal Conductive Pads
Gap-filling thermal interface pads for stable heat transfer in electronic assemblies.
Key Specifications
Thermal conductivity1.5–15 W/m·K
Thickness0.3–12 mm
HardnessSoft / custom
ElectricalInsulating options
Overview
Gap-filling thermal interface pads for stable heat transfer in electronic assemblies.
Features
- Specifications configurable for project requirements
- OEM / ODM review supported
- Documentation and installation plan to be confirmed
Applications
electronics · power-electronics
Specifications
| Thermal conductivity | 1.5–15 W/m·K |
| Thickness | 0.3–12 mm |
| Hardness | Soft / custom |
| Electrical | Insulating options |
Downloads
Documentation pending upload: product datasheets, installation guides and drawings can be added later.